Description
FreShine Chemicals Company carry hundreds of high quality Sputtering Targets with very competitive price
A sputtering target is a substance used in the technique of sputter deposition, also known as thin film deposition. During this process, gaseous ions break up the sputtering target material, which begins as a solid, into tiny particles that form a spray and coat another substance known as the substrate. Sputter deposition is frequently used in the fabrication of semiconductors and computer devices. As a result, most sputtering target materials are metallic elements or alloys, while ceramic targets that provide hardened thin coatings for diverse tools are available.
Sputtering targets vary in size and shape depending on the nature of the thin film being generated. The smallest targets have a diameter of less than one inch (2.5 cm), while the largest rectangular targets have a length of well over one yard (0.9 m). Some sputtering equipment will necessitate a larger sputtering target, in which case manufacturers will develop segmented targets joined by special joints.
Sputtering systems, or machines that do thin film deposition, have gotten much more diversified and particular in their designs. As a result, target shape and structure have begun to diversify. A sputtering target is typically rectangular or circular in shape, however many target vendors may make additional unusual shapes upon request. Certain sputtering methods necessitate the use of a revolving target in order to produce a more precise, even thin coating. These targets are designed like long cylinders and provide additional benefits such as faster deposition speeds, reduced heat damage, and increased surface area, resulting in higher overall utility.
The efficiency of sputtering target materials is determined by a number of parameters, including their composition and the sort of ions utilized to break them down. Thin films requiring pure metals for the target material will typically have greater structural integrity if the target is as pure as possible. The ions utilized to attack the sputtering target are also crucial in developing a high-quality thin coating. In general, argon is the primary gas used to ionize and start the sputtering process; however, for targets with lighter or heavier molecules, a different noble gas, such as neon for lighter molecules or krypton for heavier molecules, is more successful. To optimize the transmission of energy and momentum, and hence the evenness of the thin film, the atomic weight of the gas ions must be identical to that of the sputtering target molecules.
